Deep-tech · Advanced semiconductor materials
NanoSiN
“Solving the thermal limits of advanced chip packaging, in the interlayer.”
Founder
A wafer-thin ceramic interlayer, nanoporous silicon nitride (NPSN), that sits inside advanced chip packages between the optical light-engine and the compute die. It manages the heat and mechanical stress where light meets silicon, and keeps very fast optical signals clean, for co-packaged optics in AI and high-performance computing. The material was developed by American Technical Coatings and characterised through independent third-party laboratory testing.
- What it is
- A nanoporous silicon-nitride (NPSN) interlayer for co-packaged optics.
- The market
- Advanced chip packaging for AI & high-performance computing.
- Who it's for
- Chip- and package-makers building AI/HPC and CPO modules.